COM-HPC Mini Module based
on Intel® Core™Ultra Processors Series 3 (Panther Lake-H)
COM-HPC Mini Size
Intel Core™ Ultra3系列处理器
PCI Express Gen 5
尺寸 95 x 70 mm
产品规格 |
| COM-HPC |
处理器 |
| Intel® Core™ Ultra 5 325 (8 x 4.5 GHz, 12MB cache, 25W) |
内存 |
| Up to 32 GB LPDDR5x soldered down (optional up to 96 GB) |
网络 |
| 2 x 2.5 GbE with TSN support via Intel® i226 Ethernet controller series |
I/O接口 |
| 4 x1 PCIe Gen4 |
板载控制器 |
| Next Gen 6 congatec Board Controller | Multi Stage Watchdog | |
大容量存储 |
| NVMe SSD with 128GB (optional up to 1 TB capacity) |
操作系统 |
| Microsoft® Windows 11 |
图像 |
| Intel® Arc Graphics with up to 12 Xe cores or Intel Graphics with |
嵌入式BIOS |
| AMI Aptio® UEFI firmware |
安全 |
| Trusted Platform Module (TPM 2.0) |
电源管理 |
| ACPI 6.0 with battery support |
NPU/AI加速器 |
| Integrated NPU accelerator with up to 50 TOPS |
管理程序 |
| RTS Real-Time Hypervisor |
视频接口 |
| DP/DP++ |
温度 |
| Commercial: Operating Temperature: 0 to +60°C |
湿度 |
| Operating: 10 to 85% r. H. non cond. / Storage 5 to 85% r. H. non cond. |
尺寸 |
| 95 x 70 mm |

















